National Institute Of Materials Physics - Romania
Publications
711. Micro-structure and magnetic properties of Fe-Cu nanocomposites for anisotropic permanent magnets
Published: MAY 31 2005, JOURNAL OF ALLOYS AND COMPOUNDS, 395, 6, DOI: 10.1016/j.jallcom.2004.11.059
712. Space-charge-limited current involving carrier injection into impurity bands of high-k insulators
Published: MAY 16 2005, APPLIED PHYSICS LETTERS, 86, DOI: 10.1063/1.1935045
713. Polarization reversal and capacitance-voltage characteristic of epitaxial Pb(Zr,Ti)O-3 layers
Published: MAY 9 2005, APPLIED PHYSICS LETTERS, 86, DOI: 10.1063/1.1926403
714. Nickel-doped (Zr-0.8, Sn-0.2)TiO4 for microwave and millimeter-wave applications
Published: APR 25 2005, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 118, 209, DOI: 10.1016/j.mseb.2004.12.071
715. Ferroelectric solid solutions (Ba,Sr)TiO3 for microwave applications
Published: APR 25 2005, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 118, 96, DOI: 10.1016/j.mseb.2004.12.070
716. Doped versus pure TGS crystals
Published: APR 25 2005, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 118, 146, DOI: 10.1016/j.mseb.2004.12.069
717. Radiation-hard semiconductor detectors for SuperLHC
Published: APR 1 2005, NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 541, 201, DOI: 10.1016/j.nima.2005.01.056
718. Soft ferrite materials for magnetic temperature transducers and applications
Published: APR 2005, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 290, 1509, DOI: 10.1016/j.jmmm.2004.11.561
719. Effect of iron and nickel substitution on the piezoelectric properties of PZT type ceramics
Published: 2005, JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 25, 2400, DOI: 10.1016/j.jeurceramsoc.2005.03.069
720. Effect of hydrogenation on defect reactions in silicon particle detectors
Published: 2005, GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY XI, 108-109, 222, DOI: 10.4028/www.scientific.net/SSP.108-109.217
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