1. Scanning Electron Microscope Lyra 3XMU with Focused Ion Beam SEM-FIB sample preparation system (Tescan) with EBSD and EDS analysis systems (Bruker)
2. Scanning Electron Microscope S-3400 N (Hitachi) with Quantum Elphy Nanolithography System and Laser Interferometer Ultra Precision Positioning Strage (Raith)
3. Photolithography Mask Aligner EVG 620 NT with Nanoimprint Litography (EV Group)
4. Pulsed Laser Deposition (PLD) Workstation for thin layer deposition, fitted with in-situ Reflection High Energy Electron Diffraction (RHEED) analysis system (Surface)
5. Magnetron Sputtering Equipment ( Surrey NanoSystems Ltd.) with in-situ surface analysis techniques : AES, LEED (Omicron)
6. Matrix assisted pulsed laser evaporation installation – MAPLE
7. Electron lithography equipment – High resolution installation
8. CVD equipment for deposition of polymers
9. CVD equipment for deposition of carbon-based materials
10. CVD equipment for deposition of thin layers of semiconductor materials with broadband type III-V and II-VI
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