Magnetron sputtering equipment

FACILITIES /

Magnetron sputtering equipment

Deposition of semiconductor thin films and multilayer structures by magnetron sputtering: dielectrics (SiO2, TiO2, ZrO2, HfO2, Al2O3, Si3N4) and semiconductors (Si, Ge, SiGe, SiGeSn) on heated substrates or on substrates mantained at room temperature

Configuration

  • in situanalysis techniques:
    • Auger electron surface spectroscopy – AES
    • low-energy electron diffraction – LEED
    • real time in situellipsometric monitoring and profilometer for measuring thicknesses

Technical specifications

  • 10-8Torr high vacuum
  • 4 magnetrons in confocal configuration with DC and RF deposition regimes
  • fully-automated sample manipulator
  • substrate heating, degassing


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