Multi-cathode radio-frequency (RF), direct current (DC) and pulsed direct current (p-DC) Magnetron Sputtering (MS) systems

FACILITIES / NANOFABRICATION-OF-MATERIALS

Multi-cathode radio-frequency (RF), direct current (DC) and pulsed direct current (p-DC) Magnetron Sputtering (MS) systems

Multi-cathode radio-frequency (RF), direct current (DC) and pulsed direct current (p-DC) Magnetron Sputtering (MS) systems with various facilities: bias, etching and heating (up to 800 °C) of substrates; vacuum load-lock for sample transfer; vacuum systems (down to ~10-6 Pa); computerized control and process automation. The latest MS equipment, AJA PHASE II J, purchased in 2016, is shown in Fig. 1. Each MS system in Laboratory 20 is dedicated to a distinct class of materials: metallic contacts; semiconductor, dielectric and ferroelectric materials; biocompatible materials.  

Fig. 1 RF, DC and p-DC magnetron sputtering system, AJA PHASE II, for the deposition of semiconductor thin films.


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