Magnetron sputtering equipment

Deposition of semiconductor thin films and multilayer structures by magnetron sputtering: dielectrics (SiO₂, TiO₂, ZrO₂, HfO₂, Al₂O₃, Si₃N₄) and semiconductors (Si, Ge, SiGe, SiGeSn) on heated substrates or on substrates mantained at room temperature

Configuration

• in situanalysis techniques:
  • Auger electron surface spectroscopy – AES
  • low-energy electron diffraction – LEED
  • real time in situellipsometric monitoring and profilometer for measuring thicknesses

Technical specifications

• 10^-8Torr high vacuum
• 4 magnetrons in confocal configuration with DC and RF deposition regimes
• fully-automated sample manipulator
• substrate heating, degassing